April 1, 2026
Sumitomo Bakelite Co., Ltd. (Headquarters: Shinagawa-ku, Tokyo; President and Representative Director: Shinichi Kajiya) has announced mass production of the high-speed sealing cover tape SUMILITE™ CSL-Z7304, which provides sufficient peel-off strength even with short sealing times.*1 This product is specifically designed for applications involving ultra-small electronic components, requiring reliable and High-speed sealing. It is characterized by its high reliability and resistance to tearing, even when used with 4mm width carrier tapes (cover tape width: 2.6mm).
* 1 Sealing time: The time required for the cover tape and carrier tape to adhere to each other.
In recent years, the widespread adoption and increasing sophistication of smart devices have accelerated the miniaturization of electronic components, along with a growing demand for these components. As a result, further improvements in production efficiency are needed. Consequently, cover tapes used for transporting electronic components are now required to accommodate ultra-small components through narrower widths and enable faster sealing to facilitate quicker encapsulation of components into carrier tapes.
| Sealing Time | ||||
|---|---|---|---|---|
| 5ms | 6ms | 7ms | 8ms | |
| Conventional Grade | △ | △ | △ | 〇 |
| Z7304 | 〇 | 〇 | 〇 | 〇 |
- Representative sealing conditions: Sealing temperature 150°
We offer a wide range of products designed to address packaging challenges that arise with the ongoing miniaturization of components. If you have any concerns or inquiries regarding cover tape applications, please feel free to contact us at any time.
[Contact information]
Industrial Films Sales Dept, Films & Sheets Div, Sumitomo Bakelite Co., Ltd.
TEL: +81-3-5462-4140


