MobilityMiniaturization and Light Weight
Achieved process reduction and structural freedom through phenolic resin molding,
contributing to the miniaturization and weight reduction of metal substitute parts.
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- Miniaturization and Light Weight
- Plating Thermoset Composite Integration Technology (PM-Plamec series) (Under Development)
Plating Thermoset Composite Integration Technology (PM-Plamec series)
(Under Development)
Advantage
- High reliability for resin plating
- Possible to provide characteristics such as electromagnetic wave shielding properties and gas barrier properties
Two materials (Patent pending)
| Item | Unit | PM-5945 Isotropic | PM-5940 High strength |
|---|---|---|---|
| Flexural Strength | MPa | 180 | 200 |
| Average CTE | ppm | 23 | 20 |
| Isotropic | ー | 1.2 | 2.1 |
| Peel Strength | N/cm | 6.3 | 5.4 |
Cross section
Peel strength
Electromagnetic shielding
Material：specialized for plating
Method：KEC／GHz KEC
| Frequency： | 100kHz～1GHz（KEC.） 1GHz～6GHz（GHz KEC.） |
Long term reliability/Heat ageing test
By the plating that the oxidation is prohibited.
| Test method： | JISK6271,JISH8504 |
| Material ： | PM-5930 |
| Aging Temp.： | 220degC |
| Plating ： | Electroless Ni/Electrolytic Cu & Ni (double side) |
| Thickness： | 35um(double side total) |
