MobilityElectrification
High heat resistance and high insulation thermosetting resin
improves
functionality and reliability of electric power train.
- TOP
- Electrification
- Special Molding Compound for Power Control Module
Special Molding Compound
for Power Control Module
Adopting to Power Control Module Contributes to Further Miniaturization and Lightweight
Advantage
Excellent Properties (Insulation, Heat Dissipation, Heat Resistance, and Adhesiveness) Contribute to Miniaturization and High Performance.
High Heat Resistance
Development of SiC / GaN Compatible Material
| Property | Unit | G720 | G780 | G785 |
|---|---|---|---|---|
| Status | – | Mass Production | Mass Production | Mass Production |
| Resin system | – | Epoxy | New Epoxy1 | New Epoxy2 |
| Tg | ℃ | 195 | 195 | 240 |
| Weight loss ※250℃/1000hr |
％ | ＞ 2 | ＜ 2 | ＜ 2 |
| Adhesion (Ni) | – | 1.0 | 1.6 | 1.3 |
| Dielectric strength | kV/mm | 21 | 22 | 22 |
High Heat Dissipation
Develop High Thermal Conductive Mold Compound for Several Packages.
High Reliability
Development of HTRB Compatible Material
Test PKG:TO-247
I-V Curve After HTRB Test
High Insulation Resistance
Creeping Distance Becomes Shorter by High CTI
