MobilityElectrification
High heat resistance and high insulation thermosetting resin
improves functionality and reliability of electric power train.
- TOP
- Electrification
- Special Molding Compound for Electric Part Mounting Circuit Board
Special Molding Compound for Electric Part Mounting Circuit Board
Advantage
Thermal management
- Adjusted heat dissipation by compounding technology (Thermal conductivity:0.8~8W/mK)
- Molded with heat sink
Narrow filling and hight adhesion, High heat dissipation pass formation
Heat conduction simulation
By devising the shape, there is a possibility of heat dissipation equal to or better than the aluminum case.
Process-reduction
- Caseless structure
- Mountng part is moldable
- Good adhesion
Simultaneous molding of substrate and stator is possible
Abundant lineup
- Materials suitable for various molding methods
- Supply from 5 factories in the world
- Lineup of materials stored at room temperature
Core technology
Excellent formability
- Moldable from small to large modules
actual achievement
・Volume: ~300cc
・Area: 20 × 30cm
・Side:Single/Double
Encapsulation example Aluminum electrolytic capacitor
- No deformation due to low pressure molding.
Good adhesion
- Excellent adhesion between epoxy resin and solder resist
Comprete molding (scanned by Ultra Sonic)
Reliability of solder junction
- Prevention of solder cracks
- No solder cracks due to optimizing the coefficient of linear expansion of mold resin and substrate
Reduce nonlinear distortion, 92%
Application examples
Robots
Various sensor modules
- Sensors for Robots
- Sensors for Edge device
Inverter
- Coil
- Film capacitor
- ECU with High voltage circuit
- Integrated Heat exchanger module
