MobilityElectrification
High heat resistance and high insulation thermosetting resin
improves functionality and reliability of electric power train.
- Top
- Electrification
- Adhesives for Large Area Applications of Heat Dispersible Components (Non DA Paste)(Under Development)
Adhesives for Large Area Applications of Heat Dispersible Components (Non DA Paste)(Under Development)
High Thermal Adhesives For Large Area Applications
Advantage
High Thermal Conductivity: Sintering Technology Low Modulus: Low Modulus Filler/Soft Polymer
Chain
⇒The Great Solution at Large Area Adhesion!
| Sheet | Gel | Solder | Developed Material | |
|---|---|---|---|---|
| Thermal Conductivity | × | × | ◎ | ◎(>15 W/mK) |
| Modulus (Reliability) | ○ | ◎ | × | ○(<10MPa) |
| Adhesive Strength | ◎ | ◎ | × | ◎(<200℃) |
| Handling | ◎ | ○ | ○ | ○(25-60mm) |
Core Technology
Line-Up & Applications
Cooling Method
| Standard Semi-Sintering Paste |
Developed Material | |
|---|---|---|
| Sintering Technology | Yes | Yes |
| Low Modulus Filler | ー | Yes |
| Soft Polymer Chain | ー | Yes |
| Thermal | 16W/mK | 17W/mK |
| Modulus at RT | 9.4GPa | 6.6GPa |
Applications
- ・Power IC
- ・Power Module
- ・Heat Sink of The Battery for Automotive
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