MobilityAD/ADAS
In the connected and AD/ADAS fields, it supports the enhancement of
sensing functions and high-speed communication from the material aspect.
- TOP
- AD/ADAS
- Thermosetting Molding Compounds for 3D-circuit MID [Molded Interconnect Device] (Under Development)
Thermosetting Molding Compounds
for 3D-circuit MID [Molded Interconnect Device] (Under Development)
Advantage
- Possible to form fine 3D circuit
- Possible for soldering
- Better Design Flexibility
- Can be used under high temperature environment
- Maintain insulation under high temperature and humidity environment
- High reliability with high heat resistance and low CTE
| Items | EME-L (Epoxy) | PM-L (Phenolic) |
|---|---|---|
| Applications |
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