IoTRobotics
Contribute to realize advanced product design
in the field of robotics & mechanics
Special Molding Compound
for Electric Part Mounting Circuit Board
Contribute to Downsizing,
Higher Reliability of Various Modules
by Direct Molding.
Advantage
Heat dissipation
- Adjusting thermal conductivity with compounding technology
Simulation result
Available for heat dissipation
- Molded with heat sink
- Narrow filling and high adhesion, High heat dissipation pass formation
Abundant lineup
- We can propose molding materials suitable
for molding methods.
Cost reduction
- Reduction of processes and components
- Integration of control board and stator possible.
Core technology
Excellent formability
- Moldable from small to large modules
Actual achievement
・Volume: 300cc
・Area: 20 x 30cm
・Side: Single / Double
Good adhesion
- Excellent adhesion between epoxy resin and solder resist
- Comprete Molding (Scanned by Ultra Sonic)
Encapsulation Examples: Aluminum electrolytic capacitors
- No damage to electronic components due to low-pressure molding
Reliability of solder junction
- Prevention of solder cracks
Reduce nonlinear distortion , 92%
Proven by actual measurement and simulation
Application example
Robots
Various sensor modules
- Sensors for Robots
- Sensors for Edge device
Inverter
- Coil
- Film capacitor
- ECU with high voltage circuit
- Integrated heat exchanger module
