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Mobility | IoT

IoT5G/IoT

Provide reliable materials to support
high-speed & high-capacity communications

Thermosetting Molding Compounds
for 3D-circuit MID [Molded Interconnect Device]
(Under Development)

Thermosetting Molding Compounds for 3D-circuit MID [Molded Interconnect Device]

Contributing to Downsizing, Light-weighting,
Number of parts reduction and process reduction
Contributing to High Reliability 3D-circuit MID by using Thermosetting resin.

Advantage

  • Possible to form fine 3D circuit
  • Possible for soldering
  • Better Design Flexibility
  • Can be used under high temperature environment
  • Maintain insulation under high temperature and humidity environment
  • High reliability with high heat resistance and low CTE
Applications
EME-L (Epoxy) PM-L (Phenolic)
EME-L (Epoxy) PM-L (Phenolic)

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