IoT5G/IoT
Provide reliable materials to support
high-speed & high-capacity communications
High Thermally-conductive Sintering Paste
Achieve high thermal conductivity
with Ag sintering technology
Characteristics
- Full sintering
Wider process capability (Press type / Non-Press type, Air curing / N2 curing) - Semi sintering
Combine high thermal conductivity and excellent adhesion on bare Si with low filler loading
Core technology
Establish unique sintering technology with micro Ag
| Micro Ag | Nano Ag | |
|---|---|---|
| Size | 0.5～5μm | 10～100nm |
| Health impact | Low | High |
| Content of organic component | Low | High |
| Agglomeration risk | Low | High |
| Sintering effect | Low | High |
[Micro Ag + Sinterpromoting technology]
Semi sintering
Full sintering
Achievement of
Ag high sintering
Line up
Application example
Discrete, High Power LED, Power IC, Power module (Si IGBT, SiC, GaN)