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IoT5G/IoT

Provide reliable materials to support
high-speed & high-capacity communications

High Thermally Conductive Insulation

High Thermally Conductive Insulation

Reliable and high thermal conductive materials are made based on our own formulas and production techniques.

Metal Base Substrate (7W/3W)

Our lineup includes various grades, from high thermal to low thermal
Metal Base Substrate
Test items Conditions Unit ALC-1371
(120μm)
ALC-1331
(80μm)
Thermal Conductivity (LF) A W/m·K 7 3
Breakdown Voltage DC A kV >10 >10
Breakdown Voltage AC A kV 6 6
Peel Strength (35μm) A N/mm 1.7 1.5
Flammability UL94(A) - 94V-0 94V-0
Tracking Resistance A
(IEC method)
V 600 600
Tg TMA deg.C 130 100
Young's Modulus A GPa 40 21
Water Absorption D-24/23 % 0.3 0.3
Chemical Resistance 3%NeOH
40deg.C
3min
- OK OK

* These are representative values, not specification

12W/m·K PCB

Test items Conditions CLC-5201
(175µm)
Thermal Conductivity w/m・K Laser flash / 25°C >12
w/m・K Laser flash / 175°C >10
Breakdown Voltage kVrms AC / 25℃ >8
Volume Resistivity Ω・cm DC, 1 kV, 1 min / 25°C 1E+16
Ω・cm DC, 1 kV, 1 min/ 175°C 1E+13
Dielectric Constant 1MHz 4.6
Tg TMA >200

* The data table shown are representative values, not guaranteed values.

Application example

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