IoT5G/IoT
Provide reliable materials to support
high-speed & high-capacity communications
High Thermally-conductive
Epoxy Molding Compound
High thermal conductive,
high insulation,
good mold-ability,
good filling performance
Characteristics
Develop high thermal conductive mold compound for several packages.
Application example
Power module
Mold under fill (MUF)
Core technology
Establish surface treatment and filler distribution design of alumina for high thermal conductive.
Example
| Ref | Development | |
|---|---|---|
| Filler | w/o treat | w/ treat |
| Filler content | 93％ | 93％ |
| Thermal conductive | 5W/mK | 7W/mK |