Epoxy Resin Molding Compounds for Encapsulation of Semiconductor DevicesSUMIKON™ EME
These packaging materials are used in semiconductor packages and electrical components for cutting-edge electronic devices, industrial equipment, automobiles, and satellite communications, including those related to AI, and our company is a leader in this field.
Features
Excellent insulation, chemical resistance, moisture resistance, thermal durability, PKG
protection, and heat dissipation.
In addition, as an environmentally friendly product, it
does not use brominated or antimony-based flame retardants and meets UL-94 V-0 flame
retardant standards.
Summary
Role of Encapsulation of Semiconductor Devices
- To Protect the Chip from Outside Environment
- To Provide Electrical Insulation from Outside Environment
- To Provide Heat Dispersion
- Easy to Handle During Mounting Process
Application
Electronics & Electrical
Semiconductor PKG
Molding Semiconductor IC for Protection, Moisture-proof, and Insulation
(transfer
mold and compression mold)
electrical component
Semiconductor PKG
Encapsulation material of protection, moisture resistance and insulation for Electronic modules (ECU), Motor rotor magnet fixing, Stator Coil , Sensor modules, Power modules
