IoTConnectivity
Supporting High-Speed, High-Capacity
Communication
and
High-Precision Sensing
- TOP
- Connectivity
- 3D Formable Heat Dissipation Sheet
3D Formable Heat Dissipation Sheet
(Under Development)
Space Inside the Device Can Be Used as a Heat Path.
Features
Possible to Form a Heat Path on 3D Shape
- Parts to 3D Shaped Housing
- Parts with Different Heights to Housing
- Parts to Circuit Board
High Heat Dissipation Effect by Embedding Parts
| Not Used Rubber | Rubber 3W/m･K 0.5mmt |
Development 3W/m･K(xy Plane) 1.5mmt |
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| Heater Top Temp.(℃)● | 124 | 108 | 96 |
| Substrate Bottom Temp.(℃)● | 114 | 99 | 88 |
Lightweight and Low Dielectric Properties Suitable for Mobile/Wearable Communication Devices
| Prototype | General | |
| Specific Gravity | 1.6 | 2.4 |
| Dk＠10GHz | 4 | 6 |
| Df＠10GHz | 0.001 | 0.01 |
Application Exmples
Complex- ECU Boards BMS Boards Shaped Devices
ECU Boards
BMS Boards
