Video Contents of IT Materials
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Epoxy Molding Compound
Encapsulation by Epoxy Molding Compound
【Molding process】
Transfer molding
【Molding process】
Large size module molding
【Molding process】
Large volume mold by extruder and transfer molding
【Molding process】
Compression molding
【Functionalized molding compound】
Laser direct structuring on molded surface
【Evaluation method】
Testing tool introduction
【Evaluation method】
Gelation time of molding compound
【Evaluation method】
Acetone insoluble matter
【Open lab】
What we can do at our open lab
Adhesive
Adhesive
【Product introduction】
Die attach paste for semiconductor
【Product introduction】
Silver sintering paste for high thermal conductivity
【Product introduction】
Various adhesive
【Open lab】
What we can do at our open lab
Photo Imageable Dielectric
Photo Imageable Dielectric Material
【Product introduction】
Introduction of wafer buffer coat and RDL
【Open lab】
What we can do at our open lab
Substrate Material
Substrate Material
【Manufacturing technology】
Roll to roll manufacturing process of CCL
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