Sumitomo Bakelite Co., Ltd.
TOPICS

June 1, 2001
SUMITOMO BAKELITE CO., LTD.

Development of Impedance Matching, High-precision, Multi-layer Materials

SUMITOMO BAKELITE CO., LTD. (Headquarters: at 2-5-8 Higashi Shinagawa, Shinagawa ward, Tokyo; Tsuneo Moriya, President) has developed FR-4 grade high-precision multi-layer materials (Core laminate :SUMILITE ELC-4765V, Prepreg: EI-6765e) for multi-layer printed circuit boards in which interlayer thickness is realized in a very high degree of dimensional accuracy to meet the requirement for impedance matching

Societal Background

In order to cope with the increase of information to more huge volume, signal speed to faster and higher rate and frequency to higher ranges more refined functions are required than ever for printed circuit boards and in this way a new issue in a term: "Impedance Control" *represents such an important functional characteristic.

In printed circuits where high-speed signals flow, an ill-matched impedance often causes to suspend the inherent operational functions completely.

Factors regulating the "impedance" are "interlayer thickness", "circuit width", "circuit thickness" and "dielectric constant", wherein according to simulations by approximate expression the contribution (influence) of the "interlayer thickness", to the malfunction accounts for 70% approx. Thus, the "interlayer thickness allowance" for print circuit board materials proved to be the key factor.
To put it concretely, reduction of the variation of impedance from the conventional level of ±15% to ±5% will require improvement of the tolerance of interlayer thickness to be 1/2 to 1/3 of the current level. The newly developed multi-layer materials comply with this rigorous requirement.

*Note: "Impedance control" : Impedance in an alternating current on PCB
just like resistance in D.C. functions to hinder devices from exhibiting their inherent performance characteristics by reflection of signals when the impedance between mounted circuit elements and printed circuits is not matched well.
Regulating impedance for matching to prevent such malfunctions is called "Impedance control."


Description of the developed products.
The materials developed can be regarded as really epoch-making multi-layer materials
from the following points:


1. A high level of precision was realized by the achievement of interlayer thickness tolerance in 1/2 to 1/3 of hitherto available materials.
2. The other characteristics as of copper-clad laminates are exhibited same or higher than conventional materials maintaining chemical resistance to treatments by various liquids, as well as excellent machining properties including drilling and punching which are peculiar requisites for multi-layer materials.
3. The same conditions and existing equipment as those for the current FR-4 can be
used and result in multi-layer laminates with higher interlayer precision.
4. The prepreg introduced here is substantially free from resin powder drop and
will promise to improve the production yield ratio to a great extent.
5. The core materials introduced are available in a roll form which will facilitate users
to save cut losses as well as to introduce a continuous "roll to roll" manufacturing
process of PCB.


Differential Technologies
1. A technology was introduced for optimization of the distribution of molecular weight of the resin, while we drew keen attention to the reduced level of resin flow observed during the press-lamination process.
2. 2. A new technology controlling over high level of precision was introduced to improve the precision degree of each regulated parameter during production of prepregs.
3. 3. A newly built production technology allowing us to make copper-clad laminates as core materials available in a roll form was established, wherein the lamination conditions were also studied and improved.

Patents
About 20 related patents pending.

Sales Target
Sales target for fiscal year 2001:
Prepreg: 300M sqms, 3 million yen
Core laminate: 100M sqms, 2 million yen

Thank you