SUMITOMO BAKELITE CO., LTD. (Headquarters: at 2-5-8 Higashi Shinagawa, Shinagawa
Ward, Tokyo; Tsuneo Moriya, President) has been marketing semiconductor coating
resins "SUMIRESINEXCEL CRC SERIES" and recently developed a positive
photosensitive resin CRC-8600 WLP/CSP for use in rerouting by relocation of
wiring pads to an array of bumps, which has superior low-stress characteristics
and solvent resistance.
The linear expansion coefficient is designed to be
smaller than conventional rerouting resins for reduction of the stress of the
package while the solvent resistance of the resin is also improved greatly, both
of which advantages will contribute a lot to higher reliability of
devices.
By utilizing the offered new product such a thick-film of 20um
is available to facilitate the application in WLP/CSP using copper wiring.
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Positive photosensitive resin for rerouting is used in the
wafer-level and chip size packaging (WLP/CSP) fields.
It is a photosensitive
resin used for insulating film for rerouting.
A film made of the resin can
be developed in an alkaline aqueous solution and has such excellent
characteristics as low-stress, low dielectric constant and low water absorption
ratio.
In this field benzocyclobutene was used mainly as a prior,
conventional material, which, however, had various problems and demerits such as
consumption of too much solvents and fragility of the films formed
therefrom.
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