Solution

Smartphone

The delights we provide in the Smartphone field are compactness, thinness, high functionality, and usability.

  • Wafer Level Package (WLP)
  • Flip-Chip (FC)
  • Thinner Package
  • Non-Halogen Flame Retardant polycarbonate film PC Eco-Sheet Insulation Film
  • Anti-Fingerprint Hard Coating Technology (AFP)
  • Secondary Cell Negative-Electrode Materials

Wafer Level Package (WLP)

The ultimate of a downsized semiconductor package is the WLP(Wafer Level Package), where the chip size and the package size are the same. Winning rules are altered until the level is achieved, where the wafer can be mounted on a motherboard. In order to do so, an insulating material for the protection and rewiring of semiconductors, which has high electrical reliability and does not impose any extra stress on semiconductors, is required. The cutting-edge photopolymer technology supports the WLP.

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Flip-Chip (FC)

In the midst of the pursuit of small size and high functionality of electronic devices, the introduction of the filip chip package, which achieves both of the high information processing speed and the downsizing of semiconductor package, is increasing. The high reliability of the flip chip package has been secured thanks to the material that protects extremely vulnerable cutting-edge semiconductors from stress or that reduces the generation of stress itself.

[Liquid Epoxy Resins for Encapsulation of Semiconductors]

[Substrate Materials for Semiconductor Packages]

  • Overview
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Thinner Package

The downsizing, particularly slimming down, of a semiconductor package is accelerating. We need to consider not only the ways to make semiconductor packages thinner, but also ways to produce them more efficiently. We strive to develop materials that optimize resin properties to achieve high reliability and that can be produced via different production methods.

[Epoxy Resin Molding Compounds for Encapsulation of Semiconductor Devices]

[Substrate Materials for Semiconductor Packages]

  • Overview
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Non-Halogen Flame Retardant polycarbonate film PC Eco-Sheet Insulation Film

This is the first polycarbonate film in the world which has the characteristics for flame retardant without using halogen approved by UL standard and used for internal insulation film for electronic equipment. There are two types:translucent sheet with antistatic tretment on both sides and black sheet with light shield for optical equipment.

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Anti-Fingerprint Hard Coating
Technology (AFP)

The AFP hard coating (fingerprint resistant hard coating), when applied to liquid crystal display, is effective in maintaining visibility of text and images on touch-panel screens. The AFP hard coating-applied surfaces feature the following: Fingerprints or sebum secretion stains do not stand out; dirt can be wiped off easily; and they are abrasion resistant. Its apprication to acrylic or polycarbonatne nameplates and faceplates is attracting attention now.

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Secondary Cell Negative-Electrode Materials

The hard-carbon negative-electrode material achives greater battery capacity than black lead due to the cavites between clusters in the graphene layer. It excels in rate and cycle performance and low-pitch sound. The hard-carbon negative material of Sumitomo Bakelite, which is friendly to the environment and good for waterbome binders, is a secondary battery material that meets the requirements of the next generation hybird cars and electric vehicles.

  • Overview
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