Sumitomo Bakelite is serving the IC encapsulating material market as a top share supplier in the world. Since 1971, with persistent efforts towards technological innovations, we have been playing the leading role in the industry. An integrated manufacturing system comprising of 4 plants in 4 countries(i.e. Kyushu, Singapore, China, Taiwan) facilitates smoother delivery to clients worldwide. We provide encapsulating materials in a wide range to comply with versatile requirements for semiconductor packages.

Sumitomo Bakelite has been playing the role of the leading company in the encapsulating material market for IC applications since the commercialization of the materials in 1971 by strenuous technological innovations As for liquid encapsulants we can provide versatile materials which meet various specific characteristic requirements of advanced packages.
We offer a systematic worldwide customer support service from 2 countries (i.e. Utsunomiya, in Japan and Singapore)

In the domestic market of die attach paste Sumitomo Bakelite has kept the top share position and at the same time actively working for the development of its overseas markets. From 2 manufacturing bases in Japan (Utsunomiya city) and Singapore, we can provide high level and high quality products with an on-time delivery system. Sumitomo Bakelite supplies not only conventional packaging materials but also materials most actively developed for BGAs., CSPs., and other advanced and emerging packages.

In 1997, Sumitomo Bakelite commercialized the mass produced positive type photosensitive polyimides for the first time in the world. They are characterized by high resolution, high adhesion, low water absorption, and environmentally friendly stability. Please feel free to contact the responsible person and department for details.

Sumitomo Bakelite has developed die attach tapes for semiconductor assembly based on the long-valued technological level in development and production of LOC tapes and is one of the top suppliers. By the addition of this product, customers can further enrich their versatile assortments of semiconductor packages. We offer a systematic worldwide customer support service from our laboratory and manufacturing plant in Japan ( Utsunomiya city) covering from R&D to fabrication and production technologies.

Phenolic resin "bakelite" is the oldest among plastics and with about a century of history from its creation, it is still enjoying wide uses by virtue of its superior heat resistance, durability and other excellent features.
We provide a wide range of products from general purpose grades to specialty resins of super fine purity regulated to ppb low level.
We have a global network of services provided from bases in Japan, North America, Europe, and South East Asia.

UV tape for dicing process in semiconductor and related field.  UV dicing tape which Sumitomo Bakelite has developed is designed to meet variety of customers' requirements by balancing out the 3 elements of "Cohesion", "Adhesion" and "Tack strength".  It is UV curing type which can perfectly hold silicon wafer, resin substrate and other kinds of adhered.  We have a line up which can correspond to customer's variety of requirements such as "excellent chipping property" which is highest level in this industry, "low contamination" and "excellent pick up property" which can correspond to ultra thin and highly integrated wafers and substrates.

Carrier tapes allow mounting machines to securely set semiconductors and electronic parts at required positions. Embossed carrier tapes of high dimensional precision coupled with cover tapes with outstanding robustness, electric conductivity, transparency, sealing and peeling abilities, are well reputed among clients worldwide.

These are heat resistant poly-ether-imide films with conductive coatings on both surfaces to prevent static electricity which has a bad influence on TAB. They excel in heat resistance, adhesion and forming capability.