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Many metals and ceramics are used for the countermeasure against heat of
a product. Sumitomo Bakelite combined the high thermal conductivity filler,
and developed the heat dissipative resin molding compounds with both thermosetting
and thermoplastic resin. The flexibility of form increases, and a weight
saving also become possible, and they can be used widely from electronic
components to auto parts. There are insulative type and non-insulative
type.
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Applications |
Electric engineering parts, Engine parts of automotive, etc.
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Manufacturing plant |
Shizuoka Plant |
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Research laboratory |
High Performance Plastic Products Laboratories
Circuitry, Electric & Industrial Plastics Development Laboratory |
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