SUMITOMO BAKELITE CO., LTD.
Fields of Applications
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Products

Thermosetting molding materials SUMIKON® PM

Contact
High Performance Plastic Products Business Unit
Tel. +81-3-5462-4101
Fax. +81-3-5462-4887
Many metal and ceramics are used for the measure against heat of a product. Sumitomo Bakelite combined the high-fever conductivity filler, and developed the heat dissipation nature resin molding composition with both thermosetting and thermoplastic resin. The flexibility of form increases, and a weight saving also becomes possible, and deployment broad from electronic components to auto parts can be expected. There are an insulated type and an electric conduction type
 
Applications
Electric engineering parts, Engine parts of automotive, etc.
Manufacturing plant
Shizuoka Plant
Research laboratory
High Performance Plastic Products Laboratories
Heat dissipating materials of effects
Heat dissipating molding materials of SUMITOMO BAKELITE
The feature of material
thermosetting resin has with the kind of original resin/filler of our company, and combination technology -- it excelled the feature developed the material which boiled heat divergence and was excellent as it is.
GRADE
RESIN
TERMAL CONDUCTIVITY
AMMONIA FREE
COMMENT
INSULATION
PM-9630
PHONOL
0.3 W/mK
NORMAL
PM-TX110
PHONOL
1.0 W/mK
DEVELOPMENT
PM-TX115
PHONOL
1.5 W/mK
DEVELOPMENT
PM-TX130
PHONOL
3.0 W/mK
DEVELOPMENT
NON-INSULATION
PM-TX210
PHONOL
0.9 W/mK
|
MASS PRODUCTION
PM-TX230
PHONOL
3.0 W/mK
|
DEVELOPMENT
PM-TX250
PHONOL
4.8 W/mK
DEVELOPMENT
EM-TX235
EPOXY
3.6 W/mK
DEVELOPMENT