SUMITOMO BAKELITE CO., LTD.
Fields of Applications
Semiconductors | Circuits & Electronic Components | Automotive | Medical & Lab-wares & Bio | Packaging | Highly Functional Products
NewAreas
Cell-phones | Optical | Displays | High Density Jisso
Functions
Heat resistance | Ecological | Metal substitutes | Impact resistance | Heat dissipation
Products

Flexible printed circuit boards SUMILITE® TFP
Flexible PCB Top
Example of use in cell-phones
Example of use in optical storages
Example of use in LCD interconnections
Activities in high density Jisso
Ecological considerations and activities

Ecological considerations and activities
Contact
Flexible Circuitry Business Div.
Tel. +81-3-5462-4196
Fax. +81-3-5462-4882
As electric & electronic components quality requirements are focussing on less harm and more safety, we have made developments in accordance with ecological considerations.
Lead-free solder plating
Applications
This product is used instead of solder plating composed of tin and lead for connector terminals for mounting components.
Composition/specifications
Sn-1% Cu plating (Cu concentration 1±0.5%)
Standard thickness: 8±4µm (Other thicknesses and conditions available)
Properties (as of standard thickness 8µm)
Properties
Value or characteristics
Appearance
Glossy surface same as or similar to that of solder plating.
Corrosion resistance
Free from discoloring and corrosion after C treatment (85°C85%) for 1000h.
Whisker
Free from whisker generation after C treatment(85°C85%) for 1000h.
Solder wetting rate
Solder wetting coverage ratio was observed wider than 90% area of solder plating.
Peel strength
1.0N/mm (solder plating 0.9N/mm)
Measured at an angle of peeling to 90° after pressed adhesion of a plated face with another plated face.
Bending strength
Free from any cracks caused after bending tests at 180°
Melting point
227°C (solder plated at 183°C)
All the valued are presented are test data but not guaranteed.
Halogen-free FPCs
Halogen & antimony-free standards of content (our standards made from customer's requests.)
Br <0.09wt%
CJ <0.09wt%
Sb <0.05wt%
As <10ppm
Line-up of products
Single & double side copper-clad
Base film PI 12.5/25µm, adhesive 10µm
copper foil (calendered) 18/35µm
Coverlay
(1) PI 12.5µm/adhesive 25µm
(2) PI 12.5µm/adhesive 30µm
Structure of halogen-free FPCs
Double side copper-clad (3 layers)
Coverlay
Polyimide
Epoxy adhesive *1
Copper-clad laminate
Copper foil
Epoxy adhesive *2
Polyimide
Epoxy adhesive *2
Copper foil
Coverlay
Epoxy adhesive *1
Polyimide
Stiffener
Adhesive *3
Stiffener *4
Single side copper clad (3 layers)
Coverlay
Polyimide
Epoxy adhesive *1
Copper-clad laminate
Copper foil
Epoxy adhesive *2
Polyimide
Stiffener
Adhesive *3
Stiffener *4
*1/*2
Halogen free ecology of adhesives
*3 Adhesive for stiffener (sticky type or thermosetting type)
*4 Epoxy glass laminate or polyimide sheet
UL: recognized in January, 2002


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