SUMITOMO BAKELITE CO., LTD.
Fields of Applications
NewAreas
Functions
Products

Unclad laminates SUMILITE® PL/EL

Unclad laminates for electronic parts

Features and characteristics PL-1131K, PL-1131S
Formulation
Corresponding
standards JIS (ANSI)
UL
Acquisition
Article No.
Resin
Base material
Phenolic resin
Paper
PEM-P
XPC
94HB
PL-1131K
PL-1131S
Article No. PL-1131K, PL-1131S
Thickness
Properties
Unit
Processing
conditioning
1.0mm
1.2mm
1.6mm
Proper punching
temperature range
ºC
-
20-60
20-60
60-100
Punching
shrinkage
(150mm length)
Punching
temperature
ºC
30
30
60
MD
%
-
0.05
0.03
0.02
TD
-
0.03
0.02
0.03
ŠPunched hole shrinkage
mm
-
0.06
0.08
0.13
Insulation resistance
C-90/20/65
D-2/100
1×105
1×105
1×105
5×102
5×102
5×102
Dielectric constant (IMHZ)
-
C-90/20/65
4.5
4.3
4.3
Dielectric dissipation
factor (IMHZ)
-
C-90/20/65
0.036
0.036
0.037
Flexural
strength
MD
Mpa
A
150
140
130
TD
130
120
120
Water absorption
%
E-24/50+D-24/23
1.5
1.2
1.0
Solvent resistivity
(Trichloroethylene
resistivity)
Boiling for 2 min.
Constant
Dimensional
ranges
Size
mm
-
1000×1000
Thickness
PL-1131K 0.5-2.0
PL-1131S 0.6-2.0
UL flame retardance
-
-
94HB
Note
Punched hole shrinkage: hole diameter 1.00mmØ, clearance 01mmØ
The alphabet indicates the kind of conditioning of test piece.
A: as received without conditioning; C: conditioned in air at constant temprarure and humidity; D: immersed in water at constant temperature; E: conditioned in air at constant temperature
The data mentioned above is not guarantee value but representative one.