For the lapping of semiconductor wafers, liquid crystal display glass, memory disks cloth base and glass cloth base, laminated sheets have been popularly used as conventional carrier materials. However, as lapped objects become thinner and thinner, the quality requirements for these laminated sheets are getting more and more stringent with respect to thickness accuracy, friendliness to lapped devices. Carrier materials must also be mechanically strong and tough. Sumitomo Bakelite is prepared to supply materials that fully satisfy these requirements.

Applications:

Lapping carriers for semiconductor wafers, liquid crystal display glass, hard disks, crystals, etc.