SUMITOMO BAKELITE CO., LTD.
Fields of Applications
Semiconductors | Circuits & Electronic Components | Automotive | Medical & Lab-wares & Bio | Packaging | Highly Functional Products
NewAreas
Cell-phones | Optical | Displays | High Density Jisso
Functions
Heat resistance | Ecological | Metal substitutes | Impact resistance | Heat dissipation
Products

Unclad laminates SUMILITE® PL/EL
Unclad laminates Top
Unclad laminates for electronic parts
Unclad laminates for electric & electronic apparatus and appliance via punching
Unclad laminates for machines and electrical apparatus via machining
Unclad laminates for carriers
Unclad laminates for reinforcing FPC (Flexible Printed Circuits)
Super-Hemit (Insulation board)

Unclad laminates for electric & electronic apparatus and appliance via punching
Features and characteristics EL-3765GF
Formulation
Corresponding standards JIS (ANSI)
Article No.
Thickness
Resin
Base material
Epoxy resin
Glass cloth
GEF
FR-4
EL-3765GF
1.0
Properties
Unit
Processing conditioning
Insulation resistance
MΩ
C-90/20/65
5×107
D-2/100
4×106
Dielectric constant (IMHZ)
-
C-90/20/65
4.7
Dielectric dissipation factor (IMHZ)
-
C-90/20/60
0.009
Heat resistivity
-
A
180ºC, 120min.
Flexural strength
MD
Mpa
A
610
TD
500
Water absorption
%
E-24/50+D-24/23
0.15
Solvent resistivity
(Acetone resistivity)
Boiling for 30 min.
Constant
Dimensional ranges
Size
mm
-
1000×1000
Thickness
0.1-1.6
UL flame retardance
-
-
94-V-0
Halogen content
Chlorine
%
JPCA ES01
< 0.09
Bromine
Note1
Tests were performed according to JIS K6911.

Note2
The alphabet indicates the kind of conditioning of test piece.
A: as received without conditioning; C: conditioned in air at constant temperature and humidity; D: immersed in water at constant temperature; E: conditioned in air at constant temperature; O: immersed in oil at constant temperature
The data mentioned above is not guarantee value but representative one.

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