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Unclad laminates SUMILITE® PL/EL

Unclad laminates for electric & electronic apparatus and appliance via punching

Features and characteristics PL-1131C
Formulation
Corresponding standards JIS (ANSI)
Article No.
Thickness
Resin
Base material
Phenolic resin
Paper
PEM-P
XPC
PL-1131C
1.5
Properties
Unit
Processing conditioning
Proper punching temperature range
ºC
-
30-90
Punching shrinkage
(150mm length)
Punching temperature
ºC
60
MD
%
-
0.04
TD
-
0.07
Flatwise dielectric strength
MV/m
C-90/20/65
18
Insulation resistance
C-90/20/65
1×105
D-2/100
1×103
Dielectric constant (IMHZ)
-
C-90/20/65
6.0
Dielectric dissipation factor (IMHZ)
-
C-90/20/60
0.055
Heat resistivity
-
A
120ºC, 120min.
Flexural strength
MD
Mpa
A
150
TD
130
Water absorption
%
E-24/50+D-24/23
1.30
Solvent resistivity
(Acetone resistivity)
Boiling for 30 min.
Constant
Specific gravity
-
-
1.33
Dimensional ranges
Size
mm
-
1000×1000
Thickness
0.5-2.5
UL flame retardance
-
-
94HB
Example of products
-
-
Small electronics parts
(Cold punch)
Note1: Tests were performed according to JIS K6911.

Note2: The alphabet indicates the kind of conditioning of test piece.
A: as received without conditioning; C: conditioned in air at constant temperature and humidity; D: immersed in water at constant temperature; E: conditioned in air at constant temperature; O: immersed in oil at constant temperature
The data mentioned above is not guarantee value but representative one.