SUMITOMO BAKELITE CO LTD: 03_19_a

Unclad laminates SUMILITE^® PL/EL

	Unclad laminates Top

	Unclad laminates for electronic parts

	Unclad laminates for electric & electronic apparatus and appliances via punching

	Unclad laminates for machines and electrical apparatus via machining

	Unclad laminates for carriers

	Unclad laminates for reinforcing FPC (Flexible Printed Circuits)

	Super-Hemit (Insulation board)

Unclad laminates for machines and electrical apparatus via machining

Features and characteristics PL-1102

Formulation		Corresponding standards JIS (ANSI)		Article No.	Thickness
Resin	Base material
Phenolic resin	Paper	PEM	X	PL-1102	13

Properties		Unit	Processing Conditioning
Flatwise dielectric strength		MV/m	C-90/20/65	16
Edgewise dielectric strength		KV	O-0.5/90	9
Insulation resistance		MΩ	C-90/20/65	1×10⁴
			D-2/100	1×10²
Heat resistivity		-	A	130ºC, 120min.
Flexural strength	MD	Mpa	A	200
	TD			180
Tensile strength	MD	Mpa	A	140
	TD			130
Compression strength	vertical	Mpa	A	290
	parallel			180
Izod impact strength (parallel to layer)	MD	J/cm	A	0.91
	TD			0.36
Bonding strength		KN	A	4.7
Water absorption		%	E-24/50+D-24/23	0.30
Solvent resistivity		(Acetone resistivity)	Boiling for 30 min.	Constant
Specific gravity		-	-	1.39
Dimensional ranges	Size	mm	-	1000×1000
	Thickness			3.0-50.0
Note		-	-	For general purpose

Note1: Tests were performed according to JIS K6911.

Note2: The alphabet indicates the kind of conditioning of test piece.
A: as received without conditioning; C: conditioned in air at constant temperature and humidity; D: immersed in water at constant temperature; E: conditioned in air at constant temperature; O: immersed in oil at constant temperature
The data mentioned above is not guarantee value but representative one.

Unclad laminates SUMILITE® PL/EL

Unclad laminates for machines and electrical apparatus via machining

Unclad laminates SUMILITE^® PL/EL