UV-tape for dicing process in semiconductor and related field.
UV dicing tape which Sumitomo Bakelite has developed is designed to meet variety of customers' requirements by balancing out the 3 elements of "Cohesion", "Adhesion" and "Tack strength".  It is UV curing type which can perfectly hold silicon wafer, resin substrate and other kinds of adhered.
We have a line up which can correspond to customer's variety of requirements such as "excellent chipping property" which is highest level in this industry, "low contamination" and "excellent pick up property" which can correspond to ultra thin and highly integrated wafers and substrates.

Applications

Dicing process use for silicon wafer
Dicing process use for resin substrate
Dicing process use for other adhered
Use of transcript, transferring chips and other use which adhesion control is needed

manufacturing plant

Amagasaki plant

Research laboratory

Films & Sheets Research Laboratory