Electrical and Electronic Equipment

Products

 

Semiconductor Packages

SUMIKON® EME

Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.

SUMIRESIN EXCEL® CRM

Materials for BGAs, CSPs and other advanced packages under development

 

Semiconductor Wafers

SUMIRESIN EXCEL® CRC

Products with superior properties of high resolution, strong adhesion, low moisture water absorption and environmental safety

 

Semiconductors

Resins for Photoresist

We offer high performance polymer for flat panel display and semiconductor photoresist applications with our unique technology.

Dicing tape/
UV Releaseable Tape (SUMILITE® FSL)

UV tape for dicing process in semiconductor and related field. It is UV curing type which can perfectly hold silicon wafer, resin substrate and other kinds of adherend.

 

Electronic Components

Phenolic Molding Compounds

Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.

Other Thermoset Plastic Molding Compounds

Specialized molding compounds such as epoxy, diallyl phthalate or other type (except for phenolic)

Liquid Epoxy Resin

SUMIMAC® ECR/ECH has excellent workability and safety and is widely used for electrical insulation of ignition coils, relays, sensors and capacitor applications.

Epoxy Coating Powder

SUMILITERESIN® ECP is epoxy resin-based coating powder and has excellent reliability, workability and safety with good adhesive strength, heat resistance, electrical insulation and high mechanical strength.

Heat Dissipative Materials

We offer various heat dissipative materials such as Phenolic molding compounds, Epoxy molding compounds and Epoxy liquid resin.

Molded Parts, Molding Dies

Excellent molded parts molding dies with high precision made of thermoset plastic molding compounds molded parts.

PC

PC plate has outstanding impact resistance and heat resistance at both high and low temperature.

FINELITE MR

FINELITE MR is designed for optical application, such as cover layer of liquid crystal display where defect-free appearance is required.

Cover Tape SUMILITE® CSL-Z

Sealed on carrier tape for semiconductors and electrical components packing for SMT process.

 

Electronic Circuits

Epoxy Resin Copper-clad Laminates SUMILITE® ELC

Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.

Epoxy Resin Multilayer PWB Materials SUMILITE® ELC

Epoxy resin multi-layer material for PWBs developed based on our resin formulation technology.

Aluminum Based Materials for PCB SUMILITE® ALC

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.

Core Material 4785GS Series

Halogen-free and environment friendly core materials that has excellentt features such as low CTE, low thermal expansion, high TG, and high heat resistance.

Prepreg Material 6785GS Series

Halogen-free and environment friendly prepreg that has excellentt features such as low CTE, low thermal expansion, high TG,and high heat resistance.

Buildup Material BLα-3700GS Series

Halogen-free and environment friendly surface insulation material that has excellentt features such as low CTE, low thermal expansion, high TG,and high heat resistance.

 

Optical Components

Polymer Waveguide

Customized Polymer waveguide depending on the customer requirements.

 

Electrical Components Packaging

Carrier Tape Materials (SUMILITE® CEL/FSL)

Raw material of carrier tape which is used as semiconductor reel-packaging.

Cover Tape (SUMILITE® CSL-Z)

Reel-form packing for semiconductors and electrical components packing for SMT process.

 

Insulation

PC Eco-Sheet (PHF Series)

PC Eco-Sheet (PHF Series)

Environmental friendly flame retardant polycarbonate sheet for electrical insulation use.

PC Eco-Sheet (VHF Series)

PC Eco-Sheet (VHF Series)

PC Eco-Sheet V series are environmental friendly polycarbonate sheets for electrical insulation purpose, with halogen-free and phosphorus-free ingredients.

 

Electrical Components

Phenolic Molding Compounds

Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.

Other Thermoset Plastics Molding Compounds

Specialized molding compounds such as epoxy, diallyl phthalate or other type (except for phenolic)

Aluminum Based Materials for PCB SUMILITE® ALC

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.

 

LED Packages

SUMIRESIN EXCEL® CRM

Materials for BGAs, CSPs and other advanced packages under development

Aluminum Based Materials for PCB SUMILITE® ALC

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.

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