Pioneer in plastics
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We provide a wide variety of encapsulating materials to satisfy various requirements for semiconductor packages.
Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.
Specialized molding compounds such as epoxy and diallylphthalate type (except for phenolic)
SUMILITERESIN®ECP is epoxy resin-based coating powder and has excellent reliability, workability and safety with good adhesive strength, heat resistance, electrical insulation and high mechanical strength.
We offer various heat dissipative materials such as PPS molding compounds, phenolic molding compounds, epoxy molding compounds and epoxy liquid resin.
Molded parts and molding dies for automotive parts.
Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.
Epoxy resin multi-layer material for PWBs developed based on our resin formulation technology.
High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.
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