Automotive/Railways/Aircraft
Electronic Components

SUMIKON®EME

We provide a wide variety of encapsulating materials to satisfy various requirements for semiconductor packages.

Phenolic Molding Compounds

Phenolic molding compounds reinforced with glass fiber, organic filler or inorganic filler.

Other Thermoset Plastic Molding Compounds

Specialized molding compounds such as epoxy and diallylphthalate type (except for phenolic)

Liquid Epoxy Resin

Specialized molding compounds such as epoxy and diallylphthalate type (except for phenolic)

Epoxy Coating Powder

SUMILITERESIN®ECP is epoxy resin-based coating powder and has excellent reliability, workability and safety with good adhesive strength, heat resistance, electrical insulation and high mechanical strength.

Heat Dissipative Materials

We offer various heat dissipative materials such as PPS molding compounds, phenolic molding compounds, epoxy molding compounds and epoxy liquid resin.

Molded Parts, Molding Dies

Molded parts and molding dies for automotive parts.

Epoxy Resin Copper-clad Laminates SUMILITE®ELC

Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.

Epoxy Resin Multilayer PWB Materials SUMILITE®ELC

Epoxy resin multi-layer material for PWBs developed based on our resin formulation technology.

Aluminum Based Materials for PCB SUMILITE®ALC

High-fever conduction, low heat thermal resistance, high electric strength, and a halogen freelancer are given.

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