Substrate Materials for Semiconductor Packages
High performance S/R Material

Products

Information of Substrate Materials for Semiconductor Packages

Factory

  • Shizuoka Plant
  • Utsunomiya Plant

Features

Higher reliability, better warpage control and thinner thickness. Material performance required for recent substrates and PCBs can be achieved by LαZ® which has excellent material property such as low CTE, high TG and high modulus.

Applications

Electronic Circuit

Package substrate, etc.

For applications that require higher reliability, better warpage control and thinner thickness boards for package substrates.

Specifications

ItemUnitGrade
LAZ-7751/7752
CTE1ppm/°C15
Tg [by DMA]°C260
Tensile
Modulus
@30°CGPa15
@250°CGPa3
Dielectric Constant (1GHz)-3.4
Dissipation Factor (1GHz)-0.006
Peel Strength (Cu12um VLP)kN/m0.7
Water Absorption (PCT-2hrs/12°C)wt%0.3

Exhibitions More

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FAX:
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