Substrate Materials for Semiconductor Packages
Prepreg Material

Products

Information of Substrate Materials for Semiconductor Packages

Factory

  • Shizuoka Plant
  • Utsunomiya Plant

Features

Higher reliability, better warpage control and thinner thickness. Material performance required for recent substrates and PCBs can be achieved by LαZ® which has excellent material property such as low CTE, high TG and high modulus.

Applications

Electronic Circuit

Package substrate, etc.

For applications that require higher reliability, better warpage control and thinner thickness board for package substrates.

Specifications

Item Unit Grade
LAZ-6785TT-R LAZ-6785GT-R LAZ-6785TS-J LAZ-6785GS-J LAZ-6785TS-FG LAZ-6785GS-FG
Glass Cloth Type- Low CTENormal Low CTENormalLow CTENormal
Prepreg Thickness
(before lamination, original PP itself)
um 30 3030303030
CTE1 xyppm/°C 9 1011131214
TG [by DMA] °C 210 210260260240240
Tensile
Modulus
@30°CGPa 22 2016151816
@250°CGPa 9 89787
Dielectric Constant (1GHz)- 3.9 4.13.74.03.73.8
Dissipation Factor (1GHz)- 0.0080.0070.010.0090.010.008
Peel Strength (12um VLP)kN/m 0.9 0.90.80.80.80.8
Water Absorption (PCT-2hrs/121°C)wt% 0.8 0.80.40.40.30.3

All Grade = Halogen free material

Exhibitions More

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