Substrate Materials for Semiconductor Packages
Core Material

Products

Information of Substrate Materials for Semiconductor Packages

Factory

  • Shizuoka Plant
  • Utsunomiya Plant

Features

Higher reliability, better warpage control and thinner thickness. Material performance required for recent substrates and PCBs can be achieved by LαZ® which has excellent material property such as low CTE, high TG and high modulus.

Applications

Electronic Circuit

Package substrate, etc.

For applications that require higher reliability, better warpage control and thinner thickness boards for package substrates.

Specifications

Item Unit Grade
LAZ-4785TH-M LAZ-4785TH-JB LAZ-4785GH-J LAZ-4785TH-G LAZ-4785GH-G ELC-4785TH-B LAZ-4785GS-BA
Glass Cloth Type - Low CTE Low CTE Normal Low CTE Normal Low CTE Normal
CTE1 xy ppm/°C 1.6 2 5 4 7 6 10
CTE1 z ppm/°C 12 12 12 12 12 12 16
Tg [by DMA] ppm/°C 210 280 280 255 255 265 265
Tensile
Modulus
@30°C GPa 35 34 32 32 31 32 29
@250°C GPa 18 26 21 21 20 21 18
Dielectric Constant (1GHz) - 4.1 4.3 4.3 4.0 4.2 4.0 4.2
Dissipation Factor (1GHz) - 0.008 0.007 0.007 0.005 0.005 0.006 0.007
Peel Strength (Cu12um VLP) kN/m 0.9 0.7 0.7 0.7 0.7 0.7 0.8
Water Absorption
(PCT-2hrs/121°C)
wt% 0.4 0.4 0.4 0.4 0.4 0.4 0.4

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