Substrate Materials for Semiconductor Packages
Buildup Material

Products

Information of Substrate Materials for Semiconductor Packages

Factory

  • Shizuoka Plant
  • Utsunomiya Plant

Features

Higher reliability, better warpage control and thinner thickness. Material performance required for recent substrates and PCBs can be achieved by LαZ® which has excellent material property such as low CTE, high TG and high modulus.

Applications

Electronic Circuit

Package substrate, etc.

For applications that require higher reliability, better warpage control and thinner thickness boards for package substrates.

Specifications

UnitLαZ
BLα-3700GS
Tg(by DMA)200
Tg(by TMA)180
CTE1ppm/℃35
CTE2ppm/℃120
Tensile Modulus(R.T.)G Pa5
Tensile Modulus(250℃)G Pa0.2
Dielectric constant(1GHz)3.1
Dielectric Dissipation Factor(1GHz)0.012
Moisture Absorptionwt%1.0
(0.2t)(PCT-2hr/121℃)

Exhibitions More

Call or email us about our Division/Department.

TEL:
+81-3-5462-4244
FAX:
+81-3-5462-4905

※9:00-17:40 Mon.-Fri. (JST)