LαZ Business Division

LαZ is material developed for advanced IC packages by Sumitomo Bakelite Co., Ltd., the leading company in the semiconductor material market.

Higher reliability, better warpage control and thinner thickness.Material performance required for recent substrates and PCBs can be achieved by LαZ® which has excellent material property such as low CTE, high TG and high modulus.

Substrate Materials for Semiconductor Packages

Product information on Semiconductor Package Substrate Materials

Core Material

Halogen free and environment friendly core material with excellent material properties such as low CTE, high TG and high modulus.

Prepreg Material

Halogen free and environment friendly prepreg material with excellent material properties such as low CTE, high TG and high modulus.

Buildup Material

Halogen free and environment friendly build-up material with excellent material properties such as low CTE, high TG and high modulus.

High performance S/R Material

Halogen free and environment friendly S/R Material with excellent material properties such as low CTE, high TG and high modulus.

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