Liquid Epoxy Resins for Encapsulation of Semiconductors
SUMIRESIN EXCEL®CRP

Products

Sumitomo Bakelite Co., Ltd. supplies multi-quality liquid encapsulation materials for advanced packages. With persistent technology innovation, we continue making contributions to industries and solidifying our place as the leading company. We are able to supply multi-quality liquid encapsulation materials for advanced packages from Japan.

Plants

  • Utsunomiya Plant

Features

High Adhesion and High Reliability

High adhesion to each part of a semiconductor package realizes high reliability.

For Surface Mount Technology

Optimized physical properties of resins decrease failures in the reflow process.

Applications

Electrical and Electronic Equipment

Semiconductor Package

Potting resin for BGA, Underfill resin for flip chip package

Specifications

Line upMain ApplicationsFeatures
CRP-3300 seriesPotting ResinBGAHigh adhesion
CRP-3400 seriesPotting ResinBGALow stress
CRP-4160 seriesCapillary Underfill FCBGA/CSPHigh reliability High flowability

Examples

Flip chip package

Exhibitions More

Call or email us about our Division/Department.

TEL:
+81-3-5462-4015
FAX:
+81-3-5462-4883

※9:00-17:40 Mon.-Fri. (JST)

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