※9:00-17:40 Mon.-Fri. (JST)
Sumitomo Bakelite Co., Ltd. supplies multi-quality liquid encapsulation materials for advanced packages. With persistent technology innovation, we continue making contributions to industries and solidifying our place as the leading company. We are able to supply multi-quality liquid encapsulation materials for advanced packages from Japan.
High adhesion to each part of a semiconductor package realizes high reliability.
Optimized physical properties of resins decrease failures in the reflow process.
Potting resin for BGA, Underfill resin for flip chip package
|Line up||Main Applications||Features|
|CRP-3300 series||Potting Resin||BGA||High adhesion|
|CRP-3400 series||Potting Resin||BGA||Low stress|
|CRP-4160 series||Capillary Underfill||FCBGA/CSP||High reliability High flowability|