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General properties of Aluminum based materials for PCB SUMILITE® ALC

Test Item Measuring method Unit ALC-1331
(Insulation layer120μm)
ALC-1371
(Insulation layer120μm)
Coefficent of thermal expansion CTE (α1) ppm 15 14
CTE (α2) 52 49
Glass Transition Temperature TMA 10ºC/min ºC 100 130
DMA 5ºC/min 100 130
Breakdown Voltage A kV >10 >10
E-1000/125 >10 >10
-65ºC 30min⇔125ºC 30min
1000cycle
>10 >10
Breakdown Voltage A 7 6.5
Solder heat resistance S-30"/288dip - Non-delamination Non-delamination
S-120"/300float
Peel strength 35μm A kN/m 1.5 1.7
E-1000/125 1.4 1.6
Moisture/reflow sensitivity 40ºC 90% 5weeks - Non-delamination Non-delamination
260ºC max reflow
Dielectric constant A - 7.2 7.6
D-24/23 7.7 7.8
Dissipation Factor A - 0.014 0.010
D-24/23 0.025 0.012
Volume resistivity A Ω•cm 3E+15 1.00E+16
C-96/40/90 6E+13 2.00E+14
Surface resistivity A Ω 3.00E+15 2.10E+15
C-96/40/90 1.00E+14 1.20E+14
Water absorption 85ºC 85% 336hr % 0.3 0.3
Anti-tracking A v >600 >600
Flame resistance UL-94V - - V-0 V-0
Thermal conductivity Laser flash method - W/mk 3.0 7.0

Remark

  • The data mentioned above is not guaranteed value but representative one.