UV tape for dicing process in semiconductor and related field. UV dicing tape which Sumitomo Bakelite has developed is designed to meet variety of customers' requirements by balancing out the 3 elements of "Cohesion", "Adhesion" and "Tack strength". It is UV curing type which can perfectly hold silicon wafer, resin substrate and other kinds of adherend.
"Excellent chipping property" which is highest level in this industry
Our dicing tape can properly hold silicon wafer,resin substrate,and other kinds of adhered,and offer clear cut line to you.
"Excellent pick up property" which can correspond to ultra thin and highly integrated wafers and substrates
Adhesion strength after UV is very low. Our dicing tape can pick up thin wafer ,and can be used for the most advanced application.
"low contamination"of the surface and the side of wafer or resin substrate.
The contamination is little after dicing or peeling our dicing tape.
Electrical and Electronic Equipment
The process of dicing wafer,resin substrate,and the other kinds of adhered The process of transferring chip. Other uses which need the adhesive control
|N4000 series||standard grade|
|N5000 series||resin substrate|
|N6000 series||variant size chip|
|N7000 series||thin wafer|
|N8000 series||ultra thin wafer|
Wafers, resin, substrate, other adherends
N4000,6000,7000,and 8000 series are for dicing wafer. N5000 series are for dicing resin substrate. About other adherends, please contact us.
- 2012/05/25 Company Office Relocation of Sumitomo Bakelite (Thailand) Co., Ltd.