Carrier Tape Materials
Cover Tapes (SUMILITE®CSL-Z)

Products

Carrier tape base materials for semiconductors and electrical components packing for SMT process.

Plants

  • Amagasaki Plant

Laboratory

  • Technical Development Department, Carrier Tape Business Division

Features

Tearing-free at high speed mounting process

No tearing at high-speed mounter by high endurance material. (If used under proper sealing/peeling condition)

Wide sealing operation range

Required peeling strength can be obtained since our cover tape is not dependent much on sealing temp and pressure.

Superior sealing stability

Small aged deterioration of peel strength after sealing. High stronger reliability at high temp and humidity

Trouble shooting in surface mount process

We, Sumitomo Bakelite Co., Ltd. can provide total solution to prevent from devices sticking to cover tape film surface or devices jumping/migration from carrier tape pocket.

Please feel free to contact us without hesitation.

Applications

Electrical and Electronic Equipment

Electrical Components Packing

Cover Tape for Semiconductors and Electronic Components Devices

Reel-form packing for Semiconductors such as QFP, SOT and CSP, Electronic Components such as LED, Capacitor, Resistor, Connector, and Crystal Oscillator.

Specifications

Item Unit Method Type
CSL-Z7302
Standard
CSL-Z7500
Excellent
Triboelectric Charge
Performance
CSL-X7601
Enhanced
Surface Resistance
Under Dry Condition
NEW *3
Tensile Strength MPa JIS K6734 92 92 95
Luminous
Transmittance
% JIS K7105 87 87 87
Haze % JIS K7105 25 22 15
Surface
Resistivity
PET Ω IEC61340 ANSI ESD STM11.13
23°C×50%RH
10 10_11 10 10_11 10 6_7
SEAL 10 8_9 10 7_8 10 7_8
PET IEC61340 ANSI ESD STM11.13
23°C×30%RH
10 10_11 10 10_11 10 6_7
SEAL 10 8_9 10 7_8 10 7_8
PET IEC61340 ANSI ESD STM11.13
23°C×12%RH
10 11_12 10 11_12 10 6_7
SEAL 10 8_9 10 7_8 10 7_8
Electrification
voltage
at Peeled Off
V SB *1
23°C×50%RH
15 10 10
SB *1
23°C×30%RH
140 65 15
Triboelectric Charge nC SB *2
23°C×30%RH
0.25 0.02 0.02

Remark

  • The data given above are not guaranteed values.
  • SB Method
    *1) Electrification voltage which is measured when cover tape is peeled off at a speed of 0.1sec/tact.
    *2) Triboelectric Charge which is measured when resin for molding is vibrated on cover tape at 600 rpm for 5 minutes
  • *3) Enhanced Surface Resistance on both side under Dry Condition

Exhibitions More

Call or email us about our Division/Department.

TEL:
+81-3-5462-4049
FAX:
+81-3-5462-4897

※9:00-17:40 Mon.-Fri. (JST)