SUMITOMO BAKELITE CO LTD: Products [Cell-phones]

Cell-phones

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List of released topics

	September 30, 2004		Notification of Price Revision of EMCs for Encapsulation of Semiconductors
	July 19, 2001		Development of Flexible PCB Business by Shifting Manufacture to Offshore Bases

Flexible printed circuit boards SUMILITE®TFP


		Among the necessities of life are cell phones and Personal Handyphone System. Particularly foldable cell phones are more compact and lighter in weight and they are getting more convenient for use day by day. Flexible substrates are the very supporter of such useful apparatus. They exhibit outstanding flexural durability at the hinge part where specific bending strength is required. Such an advantageous feature plays an important role when used for notebook PC's hinge part.		Applications: Interconnections and wiring of display devices for PCs, cell phones, PDAs, etc.

Precision molded products


		Electronic and optical application: our precision hoop molding technology allows making low profile & low cost. IT/Audio application: it is possible to make not only CDs, but also DVDs and Blue-Ray optical pick-up bases plastics owing to outstanding heat radiation and dimensional stability of our own development.		Applications: Electronic components: SMD packages for mobile communication apparatus. IT/Audio related parts: Optical pick-up base for CDs, DVDs and Blue-Ray and shassis

Precision molds


		We are prepared to comply with customers' diverse needs with an integrated system for customer satisfaction from a selection of materials, manufacture of molds & tools to assay and evaluation of molding/molded products. Consult us for solutions not only to enhance your existing products but also to develop and commercialize your products in new areas.		Applications: Auto-parts, electric engineering parts such as magnet switches, breakers, fuel batteries, etc.

Epoxy resin coating powder for electrical insulation SUMILITERESIN®ECP


		SUMILITERESIN^® ECP is widely used for insulating coating outer skin of capacitors and varistors mounted on battery chargers of cell phones.		Applications: Ceramic capacitors, varistors, etc.

Liquid epoxy resins for electric & electronic components SUMIMAC®ECR/ECH


		We have developed single component type liquid epoxy resins for secondary underfill SUMIMAC^® ECR-9000 SERIES which improve the bonding strength between substrates of cell phones and BGAs And CSPs mounted thereon. Our lined up materials include extremely tough and robust as well as well-repairable grades.		Applications: Underfill as secondary Jisso mounting

Epoxy resin multilayer PWB materials SUMILITE®ELC


		• Sumitomo Bakelite supplies various kinds of multilayer PWB materials designed to bring out excellent functions. In addition to heat resistance and dielectric properties which contribute to reliability enhancement, these materials are also compliant to build-up and impedance control requirements. • Environment friendly (Halogen-free) materials are also available. • New plant in Macau starts in production in July 2003, which constitutes another production base in our worldwide supply chain.		Applications: Computer: Large size computers, servers, personal computers, etc. Mobile apparatus: Cell phones, hand-held computers, PDAs, etc. Communication infrastructures: ATM exchangers, base stations of cell-phone network, rooters, etc. Semiconductors: CPS/BGA packages, MCMs, SIMMs./DIMMs, TV game players, etc. Others: Digital household appliances, Automotive/ITS, Office automation machines, Testing, inspecting instruments, etc.

Super engineering plastics films SUMILITE®FS


		SUMILITE^® FS1000 SERIES are highly functional plastics films which have heat resistance, chemical resistance, mechanical strength and various other characteristics. Electronic and mechanical devices composed of these films can be enhanced greatly in reliability.		Applications: Thrust bearings of motors, reinforcement of FPCs.

Epoxy resin molding compounds for encapsulation of semiconductor devices SUMIKON®EME


		Sumitomo Bakelite is serving the IC encapsulating material market as a top share supplier in the world. Since 1971, with persistent efforts towards technological innovations, we have been playing the leading role in the industry. An integrated manufacturing system comprising of 4 plants in 4 countries (i.e. Kyushu, Singapore, China, and Taiwan) facilitates smoother delivery to clients worldwide. We provide encapsulating materials in a wide range to comply with versatile requirements for semiconductor packages.		Applications: Protection, moisture prevention, insulation of semiconductor devices by forming molded packages for various semiconductors sealed therein.

Coating resins for semiconductor wafers SUMIRESIN EXCEL®CRC


		In 1997, Sumitomo Bakelite became the first in the world to commercialize and mass produce positive type photosensitive polyimides. They are characterized by high resolution, high adhesion, low water absorption, and environmentally friendly stability. Please feel free to contact the responsible person and department for details.		Applications: Semiconductor wafer buffer coatings, rerouting of semiconductor wafer level packages including bumping.

Adhesive tapes for assembling semiconductors SUMILITE®IBF


		Stacked CSPs comprising a Flash and a SRAM as double staged devices are widely adopted for cell phones. It is estimated in the future the number of stacked stages will be further increased where the bonding between chips will be difficult by conventional paste and die-attach films will be the main stream. Die-attach films of Sumitomo Bakelite can be laminated at normal temperature which effectively prevents warpage because no thermal stress is imposed on laminated films.		Applications: Adhesion of IC chips with lead frames and organic substrates. Newly developed die attach films with dicing function are also available.

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