In order to cope with the infinite requirement for lighter in weight and smaller in size, we are working for technological development to manufacture higher and higher density flexible printed circuits. We also provide our customers with support and assistance in respect of Jisso..

Sumitomo Bakelite is serving the IC encapsulating material market as a top share supplier in the world. Since 1971, with persistent efforts towards technological innovations, we have been playing the leading role in the industry. An integrated manufacturing system comprising of 5 plants in 4 countries(i.e. Utsunomiya, Kyushu, Singapore, China, Taiwan) facilitates smoother delivery to clients worldwide. We provide encapsulating materials in a wide range to comply with versatile requirements for semiconductor packages.

Sumitomo Bakelite has been making a great contribution to high density Jisso areas also by supplying liquid encapsulants. Particularly, our underfill encapsulants for super multi-pin flip chip BGAs. many of which employ high density packages and printing and spinning use resins are applied for wafer level CSPs.. for filling narrow pitches of bumps with good leveling. You may rest assured of the high reliabilities of devices thus packaged with our liquid resins.

In the domestic market of die attach paste Sumitomo Bakelite has kept the top share position and at the same time actively working for the development of its overseas markets. From 2 manufacturing bases in Japan (Utsunomiya city) and Singapore, we can provide high level and high quality products with an on-time delivery system. Sumitomo Bakelite supplies not only conventional packaging materials but also materials most actively developed for BGAs., CSPs., and other advanced and emerging packages.

In the market of increasing stacked type CSPs. (StackCSP) devices from 2 to 4 and 5 plies of stacking are already launched and appearing. Sumitomo Bakelite's die attach tapes are able to meet increasing more multi-plied MCPs. Particularly, the DDFs. (dicing die-attach films) enabled the lamination to 8 inch wafer at normal temperature as well as the compliance with multi-plied CSPs. The lamination at normal temperature is answering the issue of prevention of warpage to thinner chips designed for multi-staged devices which are vulnerable to thermal stresses.

Phenolic resin "bakelite" is the oldest among plastics and with about a century of history from its creation, it is still enjoying wide uses by virtue of its superior heat resistance, durability and other excellent features.
We provide a wide range of products from general purpose grades to specialty resins of super fine purity regulated to ppb low level.
We have a global network of services provided from bases in Japan, North America, Europe, and South East Asia.