SUMITOMO BAKELITE CO., LTD.
Fields of Applications
NewAreas
Functions
High Density "Jisso"
Topics

Thermosetting molding materials SUMIKON®PM

Details
Many metal and ceramics are used for the measure against heat of a product. Sumitomo Bakelite combined the high-fever conductivity filler, and developed the heat dissipation nature resin molding composition with both thermosetting and thermoplastic resin. The flexibility of form increases, and a weight saving also becomes possible, and deployment broad from electronic components to auto parts can be expected. There are an insulated type and an electric conduction type
Applications:
Electric engineering parts,Engine parts of automotive,etc.

Thermoplastic molding materials SUMIKON®FM-T series

Details
Many metal and ceramics are used for the measure against heat of a product. Sumitomo Bakelite combined the high-fever conductivity filler, and developed the heat dissipation nature resin molding composition with both thermosetting and thermoplastic resin. The flexibility of form increases, and a weight saving also becomes possible, and deployment broad from electronic components to auto parts can be expected. There are an insulated type and an electric conduction type
Applications:
Electric engineering parts,Engine parts of automotive,etc.

Liquid epoxy resin with thermal conductivity SUMIMAC®ECR/ECH

Details
We provide the adhesive paste that added liquid epoxy resin and specific fillers with a thermal conductivity function.It is exellent in bonding to plastics and metals, and thermal conductivity.
Applications:
Electric engineering parts, Light parts, Industrial equipments